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F4BTM300 PCB 2-layer, 40 mil thick, immersion gold, suitable for radar, microwave, and RF applications

Bicheng Technologies Limited
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F4BTM300 PCB 2-layer, 40 mil thick, immersion gold, suitable for radar, microwave, and RF applications

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Brand Name : Bicheng Technologies Limited

Model Number : BIC-927-N0.927

Certification : UL

Place of Origin : China

MOQ : 1

Price : USD9.99-99.99

Payment Terms : T/T/Paypal

Supply Ability : 50000 pieces per month

Delivery Time : 10 working days

Packaging Details : Vacuum

NUMBER OF LAYERS : 2

GLASS EPOXY : F4BTM300

FINAL HEIGHT OF PCB : 1.1mm ±10%

FINAL FOIL EXTERNAL : 1oz

SURFACE FINISH : Immersion gold

SOLDER MASK COLOR : Black

COLOUR OF COMPONENT LEGEND : White

TEST : 100% Electrical Test Prior Shipment

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F4BTM300 PCB 2-layer, 40 mil thick, immersion gold, suitable for radar, microwave, and RF applications

Introduction of F4BTM300:
Wangling's F4BTM300 laminates are meticulously crafted by blending fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin through precise pressing processes. Leveraging the F4BM dielectric layer as a foundation,

the F4BTM300 series integrates high dielectric and low loss nano-level ceramics, enhancing the dielectric constant, heat resistance, thermal expansion coefficient, insulation resistance, and thermal conductivity while preserving low loss attributes.

F4BTM300 and F4BTME300 share a common dielectric layer but differ in copper foils: F4BTM employs ED copper foil,

suitable for applications not requiring PIM compliance, while F4BTME is paired with reverse-treated (RTF) copper foil,

ensuring superior PIM performance, precise line control, and reduced conductor loss.

Features of F4BTM300:

  • Dielectric constant (Dk) of 3.0 at 10GHz
  • Dissipation factor of 0.0018 at 10GHz
  • Thermal expansion coefficient (CTE) in x-axis: 15 ppm/°C, y-axis: 16 ppm/°C, z-axis: 78 ppm/°C (-55°C to 288°C)
  • Low thermal coefficient of Dk at -78 ppm/°C (-55°C to 150°C)
  • Moisture absorption of less than 0.05%
  • UL-94 V0 flammability rating

PCB Stackup:

  • 2-layer rigid PCB
  • Copper layer 1: 35 μm
  • F4BTM300 Core: 1.016 mm (40mil)
  • Copper layer 2: 35 μm
  • PCB Construction Details:
  • Board dimensions: 84.33mm x 59.5mm, 2 pieces, with a tolerance of ±0.15mm
  • Minimum Trace/Space: 4/6 mils
  • Minimum Hole Size: 0.3mm
  • No blind vias
  • Finished board thickness: 1.1mm
  • Finished Cu weight: 1oz (1.4 mils) on outer layers
  • Via plating thickness: 20 μm
  • Surface finish: Immersion gold
  • Top Silkscreen: White
  • Bottom Silkscreen: None
  • Top Solder Mask: Black
  • Bottom Solder Mask: None
  • 100% Electrical test conducted before shipment

PCB Statistics:

  • Components: 16
  • Total Pads: 47
  • Thru-Hole Pads: 32
  • Top SMT Pads: 15
  • Bottom SMT Pads: 0
  • Vias: 31
  • Nets: 2

Additional Information:

  1. Artwork Format: Gerber RS-274-X
  2. Quality Standard: IPC-Class-2 compliant
  3. Availability: Worldwide

Typical Applications:

  • Microwave, RF, and radar systems
  • Phase shifters
  • Power dividers, couplers, combiners
  • Feed networks
  • Phase-sensitive antennas, phased array antennas
  • Satellite communications
  • Base station antennas

F4BTM300 PCB 2-layer, 40 mil thick, immersion gold, suitable for radar, microwave, and RF applications


Quality F4BTM300 PCB 2-layer, 40 mil thick, immersion gold, suitable for radar, microwave, and RF applications for sale

F4BTM300 PCB 2-layer, 40 mil thick, immersion gold, suitable for radar, microwave, and RF applications Images

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